Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935830 | Integrated circuit with frontside and backside conductive layers and exposed backside substrate | Te-Hsin Chiu, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-03-19 |
| 11909396 | Integrated circuit including back side conductive lines for clock signals | Kam-Tou Sio | 2024-02-20 |