Issued Patents 2024
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176387 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu +4 more | 2024-12-24 |
| 12159873 | Semiconductor structure and manufacturing method thereof | Yung-Chih Tsai, Chih-Ping Chao, Chun-Hung Chen, Shaoqiang Zhang, Kuan-Liang Liu +1 more | 2024-12-03 |
| 12113071 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Chia-Shiung Tsai, Ru-Liang Lee +1 more | 2024-10-08 |
| 12082505 | Integrated heater (and related method) to recover degraded piezoelectric device performance | Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Yi-Chuan Teng +3 more | 2024-09-03 |
| 12072726 | Voltage reference circuit and method for providing reference voltage | Yen-Ting Wang, Alan Roth, Eric Soenen, Liang-Tai Kuo, Hsin-Li Cheng | 2024-08-27 |
| 12074036 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Yeur-Luen Tu, Eugene Chen | 2024-08-27 |
| 12057468 | Semiconductor device with inductor windings around a core above an encapsulated die | Chien-Hsien Kuo, Hon-Lin Huang, Han-Yi Lu, Ching-Wen Hsiao | 2024-08-06 |
| 12048163 | Trench gate high voltage transistor for embedded memory | Wei-Cheng Wu, Chien-Hung Chang | 2024-07-23 |
| 12009402 | Method of forming a gate structure in high-κ metal gate technology | Wei-Cheng Wu, Shih-Hao Lo, Hung-Pin Ko | 2024-06-11 |
| 12002706 | Structure and method for enhancing robustness of ESD device | Jen-Chou Tseng, Chia-Wei Hsu, Ming-Fu Tsai | 2024-06-04 |
| 11948938 | Recessed gate for an MV device | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Hsiao-Chin Tuan, Kong-Beng Thei +2 more | 2024-04-02 |
| 11930645 | Semiconductor structure integrated with magnetic tunneling junction | Harry-Hak-Lay Chuang, Sheng-Haung Huang, Tien-Wei Chiang | 2024-03-12 |
| 11901388 | Device over photodetector pixel sensor | Jhy-Jyi Sze, Dun-Nian Yaung | 2024-02-13 |
| 11862592 | Sidewall spacer to reduce bond pad necking and/or redistribution layer necking | Kong-Beng Thei | 2024-01-02 |