Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2024-12-10 |
| 12148756 | Selective polysilicon growth for deep trench polysilicon isolation structure | Yu-Hung Cheng, Cheng-Ta Wu, Po-Wei Liu, Yu-Chun Chang | 2024-11-19 |
| 12080738 | Image sensor having stacked metal oxide films as fixed charge film | Chih-Yu Lai, Min-Ying Tsai, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-09-03 |
| 12074036 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Alexander Kalnitsky, Eugene Chen | 2024-08-27 |
| 12040221 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee +4 more | 2024-07-16 |
| 12021066 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Chia-Shiung Tsai | 2024-06-25 |
| 11955496 | Back-side deep trench isolation structure for image sensor | Cheng-Ta Wu, Kuo-Hwa Tzeng | 2024-04-09 |
| 11929379 | Conductive contact for ion through-substrate via | Min-Ying Tsai, Cheng-Ta Wu | 2024-03-12 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2024-02-27 |
| 11894408 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2024-02-06 |