Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176266 | Through-substrate via formation to enlarge electrochemical plating window | Hung-Ling Shih, Ming Chyi Liu | 2024-12-24 |
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2024-12-10 |
| 12132075 | Method (and related apparatus) for forming a resistor over a semiconductor substrate | Hung-Wen Hsu, Li-Weng Chang | 2024-10-29 |
| 12015049 | Ring structure for film resistor | Chun-Tsung Kuo | 2024-06-18 |
| 12002828 | Absorption enhancement structure to increase quantum efficiency of image sensor | Tsun-Kai Tsao, Cheng-Hsien Chou | 2024-06-04 |
| 11948962 | Charge release layer to remove charge carriers from dielectric grid structures in image sensors | Ching-Chung Su | 2024-04-02 |
| 11923394 | Concave reflector for complementary metal oxide semiconductor image sensor (CIS) | Po-Han Huang, Yu-Chun Chen | 2024-03-05 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2024-02-27 |
| 11869761 | Back-side deep trench isolation structure for image sensor | Yu-Hung Cheng, Chun-Tsung Kuo, Min-Ying Tsai, Chiao-Chun Hsu, Ching-I Li | 2024-01-09 |