Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176266 | Through-substrate via formation to enlarge electrochemical plating window | Ming Chyi Liu, Jiech-Fun Lu | 2024-12-24 |
| 12159803 | Profile of deep trench isolation structure for isolation of high-voltage devices | — | 2024-12-03 |
| 12101931 | Strap-cell architecture for embedded memory | Wen-Tuo Huang, Ping-Cheng Li, Po-Wei Liu, Yu-Ling Hsu, Yong-Shiuan Tsair +2 more | 2024-09-24 |
| 12096629 | Floating gate test structure for embedded memory device | Yong-Shiuan Tsair | 2024-09-17 |
| 12068032 | Device-region layout for embedded flash | Shih Kuang Yang, Ping-Cheng Li, Po-Wei Liu, Wen-Tuo Huang, Yu-Ling Hsu +2 more | 2024-08-20 |
| 12009033 | ONON sidewall structure for memory device and method for making the same | Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang +5 more | 2024-06-11 |
| 11869951 | Control gate strap layout to improve a word line etch process window | Yu-Ling Hsu, Ping-Cheng Li, Po-Wei Liu, Wen-Tuo Huang, Yong-Shiuan Tsair +2 more | 2024-01-09 |
| 11862535 | Through-substrate-via with reentrant profile | Wei Chuang Wu, Shih Kuang Yang, Hsing-Chih Lin, Jen-Cheng Liu | 2024-01-02 |