Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057446 | Stacked semiconductor device and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2024-08-06 |
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Zheng-Xun Li, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2024-07-09 |
| 12034037 | Backside capacitor techniques | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2024-07-09 |
| 11996429 | CMOS image sensor structure with microstructures on backside surface of semiconductor layer | Chien Nan Tu, Yu-Lung Yeh, Chien-Chang Huang, Shih-Shiung Chen | 2024-05-28 |
| 11955428 | Semiconductor structure and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2024-04-09 |
| 11942368 | Through silicon vias and methods of fabricating thereof | Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2024-03-26 |
| 11862535 | Through-substrate-via with reentrant profile | Hung-Ling Shih, Wei Chuang Wu, Shih Kuang Yang, Jen-Cheng Liu | 2024-01-02 |