Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094756 | Semiconductor arrangement comprising isolation structure comprising at least two electrical insulator layers | Wei-Liang Chen, Cheng-Hsien Chen, Chuang Chihchous, Yen-Hsiu Chen | 2024-09-17 |
| 12046615 | Semiconductor device including deep trench isolation structure comprising dielectric structure and copper structure and method of making the same | Yung-Hsiang Chen, Yen-Hsiu Chen, Bo-Chang Su, Cheng-Hsien Chen | 2024-07-23 |
| 12040221 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee +4 more | 2024-07-16 |
| 11996429 | CMOS image sensor structure with microstructures on backside surface of semiconductor layer | Chien Nan Tu, Hsing-Chih Lin, Chien-Chang Huang, Shih-Shiung Chen | 2024-05-28 |
| 11990493 | Image sensor device with reflective structure | Chun-Chieh Fang, Ming-Chi Wu, Ji Heng Jiang, Chi-Yuan Wen, Chien Nan Tu +2 more | 2024-05-21 |
| 11973148 | Surface damage control in diodes | Ting-Ying Wu, Yung-Hsiang Chen, Yen-Hsiu Chen, Wei-Liang Chen, Ying-Tsang Ho | 2024-04-30 |