Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094756 | Semiconductor arrangement comprising isolation structure comprising at least two electrical insulator layers | Wei-Liang Chen, Cheng-Hsien Chen, Yu-Lung Yeh, Chuang Chihchous | 2024-09-17 |
| 12046615 | Semiconductor device including deep trench isolation structure comprising dielectric structure and copper structure and method of making the same | Yung-Hsiang Chen, Yu-Lung Yeh, Bo-Chang Su, Cheng-Hsien Chen | 2024-07-23 |
| 12040221 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee +4 more | 2024-07-16 |
| 11973148 | Surface damage control in diodes | Ting-Ying Wu, Yung-Hsiang Chen, Yu-Lung Yeh, Wei-Liang Chen, Ying-Tsang Ho | 2024-04-30 |