Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2024-12-10 |
| 12148756 | Selective polysilicon growth for deep trench polysilicon isolation structure | Cheng-Ta Wu, Po-Wei Liu, Yeur-Luen Tu, Yu-Chun Chang | 2024-11-19 |
| 12074036 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Cheng-Ta Wu, Chen-Hao Chiang, Alexander Kalnitsky, Yeur-Luen Tu, Eugene Chen | 2024-08-27 |
| 12074186 | Isolation epitaxial bi-layer for backside deep trench isolation structure in an image sensor | Ching-I Li | 2024-08-27 |
| 12040221 | Fabrication method of metal-free SOI wafer | Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee, Victor Lu +4 more | 2024-07-16 |
| 12002813 | Method for forming semiconductor-on-insulator (SOI) substrate by cleaving a multilayer structure along voids to separate a substrate | Ching-I Li, Chia-Shiung Tsai | 2024-06-04 |
| 11869761 | Back-side deep trench isolation structure for image sensor | Chun-Tsung Kuo, Jiech-Fun Lu, Min-Ying Tsai, Chiao-Chun Hsu, Ching-I Li | 2024-01-09 |