Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113071 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Chia-Shiung Tsai, Chih-Ping Chao +1 more | 2024-10-08 |
| 12040221 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Victor Lu +4 more | 2024-07-16 |
| 11916022 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu +2 more | 2024-02-27 |