Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2024-12-10 |
| 12113071 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Ru-Liang Lee, Chih-Ping Chao +1 more | 2024-10-08 |
| 12021066 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2024-06-25 |
| 12002813 | Method for forming semiconductor-on-insulator (SOI) substrate by cleaving a multilayer structure along voids to separate a substrate | Yu-Hung Cheng, Ching-I Li | 2024-06-04 |
| 11955374 | Method for forming SOI substrate | Chi-Ming Chen, Eugene Chen | 2024-04-09 |
| 11925033 | Embedded backside memory on a field effect transistor | Kuan-Liang Liu, Sheng-Chau Chen, Chung-Liang Cheng, Yeong-Jyh Lin, Pinyen Lin +1 more | 2024-03-05 |
| 11923237 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2024-03-05 |
| 11894408 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Xiaomeng Chen, Pin-Nan Tseng | 2024-02-06 |