Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Yu-Hung Cheng +1 more | 2024-12-10 |
| 12087801 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Yen-Ting Chiang, Hsiao-Hui Tseng, Min-Ying Tsai | 2024-09-10 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2024-02-27 |
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang | 2024-02-06 |