SH

Sin-Yao Huang

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Tainan, TW: #299 of 783 inventorsTop 40%
Overall (2024): #265,938 of 561,600Top 50%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11894410 Bond pad structure for bonding improvement Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou 2024-02-06