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Ming-Tsong Wang

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #336,665 of 561,600Top 60%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11894410 Bond pad structure for bonding improvement Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou 2024-02-06