Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996433 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2024-05-28 |
| 11984465 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2024-05-14 |
| 11948949 | Vertical gate field effect transistor | Chun-Yuan Chen, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2024-04-02 |
| 11916100 | Multi-layer trench capacitor structure | Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng | 2024-02-27 |
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2024-02-06 |