Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996433 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2024-05-28 |
| 11973101 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2024-04-30 |
| 11923338 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2024-03-05 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |