Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142628 | Method of forming semiconductor device | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2024-11-12 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2024-02-27 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2024-01-02 |