Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176370 | Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen +1 more | 2024-12-24 |
| 12154927 | Semiconductor structure | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Wei Chuang Wu +3 more | 2024-11-26 |
| 12142628 | Method of forming semiconductor device | Chi-Ming Lu, Chih-Hui Huang, Jung-Chih Tsao, Yao-Hsiang Liang | 2024-11-12 |
| 12125763 | Trim wall protection method for multi-wafer stacking | Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai, Kuo-Ming Wu | 2024-10-22 |
| 12113090 | Bond pad structure for bonding improvement | Chin-Wei Liang, Sheng-Chau Chen, Hsun-Chung Kuang | 2024-10-08 |
| 12046550 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-07-23 |
| 12027554 | Composite deep trench isolation structure in an image sensor | Che-Wei Yang, Tsun-Kai Tsao, Chih-Cheng Shih, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-07-02 |
| 11908878 | Image sensor and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen +1 more | 2024-02-20 |
| 11901387 | Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen +1 more | 2024-02-13 |
| 11869916 | Bond pad structure for bonding improvement | Chin-Wei Liang, Sheng-Chau Chen, Hsun-Chung Kuang | 2024-01-09 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2024-01-02 |