MK

Min-Feng Kao

TSMC: 13 patents #221 of 4,162Top 6%
Overall (2024): #5,589 of 561,600Top 1%
13
Patents 2024

Issued Patents 2024

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12183761 Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same Sheng-Chau Chen, Cheng-Hsien Chou 2024-12-31
12176370 Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more 2024-12-24
12148781 Image sensor device Szu-Ying Chen, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung 2024-11-19
12142569 Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang 2024-11-12
12062679 Backside structure for image sensor Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Shih-Han Huang 2024-08-13
12057446 Stacked semiconductor device and method Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin 2024-08-06
12034037 Backside capacitor techniques Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu 2024-07-09
12033919 Backside or frontside through substrate via (TSV) landing on metal Zheng-Xun Li, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung 2024-07-09
12009214 Gate electrodes with notches and methods for forming the same Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung 2024-06-11
11955428 Semiconductor structure and manufacturing method thereof Hsin-Hung Chen, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung 2024-04-09
11942368 Through silicon vias and methods of fabricating thereof Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung 2024-03-26
11908878 Image sensor and manufacturing method thereof Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more 2024-02-20
11901387 Image sensor Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more 2024-02-13