Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142569 | Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2024-11-12 |
| 12081866 | Image sensor including light shielding layer and patterned dielectric layer | Yun-Wei Cheng, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee | 2024-09-03 |
| 12068271 | Semiconductor device structure and methods of forming the same | Hsin-Chi Chen, Chih-Ming Lee, Shang-Yen Wu, Chih-An Yang, Hung-Wei HO +2 more | 2024-08-20 |
| 12009323 | Semiconductor structure | Chia-Yu Wei, Cheng-Yuan Li, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2024-06-11 |
| 12010826 | Semiconductor device having a butted contact and method of forming | You Che CHUANG, Chih-Ming Lee, Hsin-Chi Chen | 2024-06-11 |