Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2024-07-09 |
ZL
Zheng-Xun Li
Overall (2024): #195,935 of 561,600Top 35%
1
Patents 2024