Issued Patents 2024
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183779 | Integrated circuit and method of forming the same | Ming-Che Lee, Sheng-Chau Chen | 2024-12-31 |
| 12185640 | MRAM MTJ with directly coupled top electrode connection | Sheng-Chau Chen, Cheng-Tai Hsiao, Hsun-Chung Kuang | 2024-12-31 |
| 12160995 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Tzu-Yu Lin, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang | 2024-12-03 |
| 12127483 | Doped sidewall spacer/etch stop layer for memory | Bi-Shen Lee, Hai-Dang Trinh, Hsun-Chung Kuang | 2024-10-22 |
| 12125763 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Kuo-Ming Wu | 2024-10-22 |
| 12102019 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Tzu-Chung Tsai, Fa-Shen Jiang | 2024-09-24 |
| 12087756 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Sheng-Chau Chen | 2024-09-10 |
| 12080738 | Image sensor having stacked metal oxide films as fixed charge film | Chih-Yu Lai, Min-Ying Tsai, Yeur-Luen Tu, Hai-Dang Trinh | 2024-09-03 |
| 12075626 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Hsun-Chung Kuang | 2024-08-27 |
| 12069971 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Hsing-Lien Lin, Wen-Ting Chu | 2024-08-20 |
| 12046550 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Sheng-Chan Li | 2024-07-23 |
| 12035537 | Interface film to mitigate size effect of memory device | Bi-Shen Lee, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang | 2024-07-09 |
| 12027554 | Composite deep trench isolation structure in an image sensor | Che-Wei Yang, Sheng-Chan Li, Tsun-Kai Tsao, Chih-Cheng Shih, Sheng-Chau Chen | 2024-07-02 |
| 12021113 | Amorphous bottom electrode structure for MIM capacitors | Hsing-Lien Lin, Jui-Lin Chu | 2024-06-25 |
| 12021066 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Yeur-Luen Tu, Chia-Shiung Tsai | 2024-06-25 |
| 11961545 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh | 2024-04-16 |
| 11951569 | Damage prevention during wafer edge trimming | Kuo-Ming Wu, Yung-Lung Lin, Hau-Yi Hsiao, Sheng-Chau Chen | 2024-04-09 |
| 11895933 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Hai-Dang Trinh, Hsing-Lien Lin, Hsun-Chung Kuang, Bi-Shen Lee | 2024-02-06 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Kuo-Ming Wu, Sheng-Chan Li | 2024-01-02 |