Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087756 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-09-10 |
| 11951569 | Damage prevention during wafer edge trimming | Kuo-Ming Wu, Yung-Lung Lin, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-04-09 |