Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160995 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang, Cheng-Yuan Tsai | 2024-12-03 |
| 12137572 | Ferroelectric memory device and method of manufacturing the same | Yi Yang Wei, Bi-Shen Lee, Hai-Dang Trinh, Hsing-Lien Lin, Hsun-Chung Kuang | 2024-11-05 |
| 12119035 | Spacer film scheme for polarization improvement | Yao-Wen Chang | 2024-10-15 |
| 11973050 | Method for forming an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance | Yao-Wen Chang, Chia-Wen Zhong, Yen-Liang Lin | 2024-04-30 |
| 11939431 | Temperature sensitive composition for tissue adhesion prevention and application thereof | Yu-Chia Chang, Yunn-Kuen CHANG, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai +2 more | 2024-03-26 |
| 11939432 | Amino acid-modified polymer for adhesion prevention and application thereof | Yu-Chia Chang, Yunn-Kuen CHANG, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai +2 more | 2024-03-26 |