Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973050 | Method for forming an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance | Tzu-Yu Lin, Yao-Wen Chang, Yen-Liang Lin | 2024-04-30 |