Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046550 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Sheng-Chau Chen, Sheng-Chan Li, Cheng-Yuan Tsai | 2024-07-23 |
| 12027554 | Composite deep trench isolation structure in an image sensor | Che-Wei Yang, Sheng-Chan Li, Chih-Cheng Shih, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-07-02 |
| 12002828 | Absorption enhancement structure to increase quantum efficiency of image sensor | Cheng-Hsien Chou, Jiech-Fun Lu | 2024-06-04 |