Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113090 | Bond pad structure for bonding improvement | Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li | 2024-10-08 |
| 11887929 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang | 2024-01-30 |
| 11869916 | Bond pad structure for bonding improvement | Sheng-Chau Chen, Hsun-Chung Kuang, Sheng-Chan Li | 2024-01-09 |