Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12161057 | Method for forming semiconductor structure | Hsing-Lien Lin, Fu-Ting Sung, Chii-Ming Wu | 2024-12-03 |
| 12150394 | Memory device structure for reducing thermal crosstalk | Huan-Chieh Chen, Yao-Wen Chang | 2024-11-19 |
| 11887929 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Hsun-Chung Kuang | 2024-01-30 |