Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12161057 | Method for forming semiconductor structure | Hsing-Lien Lin, Ching Ju Yang, Chii-Ming Wu | 2024-12-03 |
| 11950523 | Memory device, memory integrated circuit and manufacturing method thereof | — | 2024-04-02 |
| 11894267 | Method for fabricating integrated circuit device | Hsia-Wei Chen, Yu-Wen Liao, Wen-Ting Chu, Fa-Shen Jiang, Tzu-Hsuan Yeh | 2024-02-06 |