Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165996 | Bond pad with enhanced reliability | Chern-Yow Hsu | 2024-12-10 |
| 11894267 | Method for fabricating integrated circuit device | Hsia-Wei Chen, Fu-Ting Sung, Yu-Wen Liao, Wen-Ting Chu, Fa-Shen Jiang | 2024-02-06 |