Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165996 | Bond pad with enhanced reliability | Tzu-Hsuan Yeh | 2024-12-10 |
| 12133470 | Semiconductor structure and method of forming the same | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Shih-Chang Liu | 2024-10-29 |
| 12132039 | Mask transfer method (and related apparatus) for a bumping process | Ching-Sheng Chu | 2024-10-29 |
| 12114576 | Method for forming a hard mask with a tapered profile | Min-Yung Ko, Chang-Ming Wu, Shih-Chang Liu | 2024-10-08 |
| 12087826 | Method for forming a semiconductor structure | Yao-Wen Chang, Gung-Pei Chang, Ching-Sheng Chu | 2024-09-10 |
| 12010933 | Via structure and methods of forming the same | Wei-Chieh Huang, Jieh-Jang Chen, Feng-Jia Shiu | 2024-06-11 |
| 11973149 | Semiconductor device and method of forming the same | Yu-Hsing Chang, Shih-Chang Liu | 2024-04-30 |
| 11943934 | Hard mask for MTJ patterning | — | 2024-03-26 |
| 11910620 | Magnetic tunnel junction device with residue-protection sidewall spacer and the method for forming a magnetic tunnel junction device with residue-protection sidewall spacer | — | 2024-02-20 |