Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11915977 | Interconnect structure for stacked device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2024-02-27 |