Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148706 | Substrate loss reduction for semiconductor devices | Xin-Hua Huang, Kuei-Ming Chen | 2024-11-19 |
| 12010918 | Piezoelectric device with hydrogen getter | Chih-Ming Chen | 2024-06-11 |
| 11984486 | Method of implanting dopants into a group III-nitride structure and device formed | Han-Chin Chiu, Chi-Ming Chen, Chen-Hao Chiang | 2024-05-14 |
| 11932534 | MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion | Hung-Hua Lin, Chang-Ming Wu, Ping-Yin Liu, Jung-Huei Peng | 2024-03-19 |
| 11923237 | Manufacturing method of semiconductor device | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2024-03-05 |
| 11916022 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu +2 more | 2024-02-27 |
| 11901413 | Diffusion barrier layer for source and drain structures to increase transistor performance | Kuei-Ming Chen, Chi-Ming Chen | 2024-02-13 |
| 11862612 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Yeong-Jyh Lin, Rei-Lin Chu | 2024-01-02 |
| 11862720 | Rough buffer layer for group III-V devices on silicon | Kuei-Ming Chen, Chi-Ming Chen | 2024-01-02 |