Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11932534 | MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu | 2024-03-19 |