Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027469 | Electronic device package and method of manufacturing the same | En Hao HSU, Chia-Pin Chen, Chi-Long Tsai | 2024-07-02 |
| 11955496 | Back-side deep trench isolation structure for image sensor | Cheng-Ta Wu, Yeur-Luen Tu | 2024-04-09 |