Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183593 | Manufacturing method for manufacturing a package structure | Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu, Cyuan-Hong Shih, Yen-Liang Chen | 2024-12-31 |
| 12027469 | Electronic device package and method of manufacturing the same | En Hao HSU, Kuo-Hwa Tzeng, Chia-Pin Chen | 2024-07-02 |