Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183593 | Manufacturing method for manufacturing a package structure | Chia Sheng Tien, Wan-Ting Chiu, Chi-Long Tsai, Cyuan-Hong Shih, Yen-Liang Chen | 2024-12-31 |
| 12027469 | Electronic device package and method of manufacturing the same | En Hao HSU, Kuo-Hwa Tzeng, Chi-Long Tsai | 2024-07-02 |
| 12010197 | System, method and computer-readable medium for data accessing | Yung-Chi HSU, Jhu-Kai SONG, Liang-Tse CHIANG | 2024-06-11 |