Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176387 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Ting-Chen Hsu +4 more | 2024-12-24 |
| 11923352 | Semiconductor device with capacitor and method for forming the same | Hsin-Li Cheng, Yu-Chi Chang, Yingkit Felix Tsui, Shih-Fen Huang | 2024-03-05 |