Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057468 | Semiconductor device with inductor windings around a core above an encapsulated die | Chien-Hsien Kuo, Hon-Lin Huang, Ching-Wen Hsiao, Alexander Kalnitsky | 2024-08-06 |