Issued Patents 2024
Showing 101–125 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |
| 11943080 | Method for estimating dense multipath parameters by means of multipolarized broadband extended array responses | Haiming Wang, Bensheng Yang, Peize Zhang, Wei Hong | 2024-03-26 |
| 11942433 | Integrated circuit package and method | Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11935761 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2024-03-19 |
| 11935802 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2024-03-19 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Yian-Liang Kuo, Kuo-Chung Yee | 2024-03-19 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chun-Hui Yu, Kuo-Chung Yee | 2024-03-12 |
| 11929261 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Szu-Wei Lu | 2024-03-12 |
| 11923207 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-05 |
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2024-03-05 |
| 11916028 | Package structure and method of forming the same | Chun-Hui Yu, Kuo-Chung Yee | 2024-02-27 |
| 11908795 | Package structures and method of forming the same | An-Jhih Su | 2024-02-20 |
| 11908706 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2024-02-20 |
| 11901302 | InFO-POP structures with TIVs having cavities | Jing-Cheng Lin, Po-Hao Tsai | 2024-02-13 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2024-02-13 |
| 11901196 | Method for forming photonic integrated package | An-Jhih Su, Wei-Yu Chen | 2024-02-13 |
| 11894309 | System on integrated chips (SoIC) and semiconductor structures with integrated SoIC | Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2024-02-06 |
| 11894318 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-02-06 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-01-09 |
| 11869869 | Heterogeneous dielectric bonding scheme | Wen-Chih Chiou, Ku-Feng Yang, Ming-Tsu Chung | 2024-01-09 |
| 11862606 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2024-01-02 |
| 11862605 | Integrated circuit package and method of forming same | Ming-Fa Chen, Hsien-Wei Chen | 2024-01-02 |