Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148678 | Semiconductor package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang | 2024-11-19 |
| 12080681 | Package structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou | 2024-09-03 |