Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11955443 | Flip chip package structure and manufacturing method thereof | Yang-Ming SHIH, Hung-Yun HSU | 2024-04-09 |
| 11869849 | Semiconductor package with EMI shielding structure | — | 2024-01-09 |