Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955443 | Flip chip package structure and manufacturing method thereof | Shiann-Tsong Tsai, Hung-Yun HSU | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955443 | Flip chip package structure and manufacturing method thereof | Shiann-Tsong Tsai, Hung-Yun HSU | 2024-04-09 |