Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062641 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Hui Yu Lee, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu | 2024-08-13 |