Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154842 | Heat dissipation structures for three-dimensional system on integrated chip structure | Po-Hsiang Huang, Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee | 2024-11-26 |
| 12027513 | Layout design methodology for stacked devices | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Ka Fai Chang | 2024-07-02 |