Issued Patents 2024
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11874513 | Package structure | Chia-Lun Chang, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2024-01-02 |