Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131986 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2024-10-29 |
TH
Tuan-Yu Hung
Overall (2024): #233,686 of 561,600Top 45%
1
Patents 2024