TL

Tzung-Hui Lee

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 New Taipei, TW: #607 of 1,741 inventorsTop 35%
Overall (2024): #233,013 of 561,600Top 45%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12094830 Integrated fan-out (InFO) package structure Ming-Che Ho, Hung-Jui Kuo 2024-09-17