Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-06-11 |
| 11948863 | Package structure and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2024-04-02 |