Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046543 | Package substrate and chip package structure using the same | Han-Chieh Hsieh, Chao-Min Lai, Cheng-Chen Huang | 2024-07-23 |
| 12009575 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2024-06-11 |